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142 Industrial Lane MID (Minimally Invasive Device) Series Light Curable Adhesives Field failure is not an option, and that mandate resonates in every adhesive development project and with every product recommendation. Panacols’ adhesives for medical device assembly are specifically formulated to meet the critical performance and regulatory demands of this growing market. Beginning with raw material selection, Panacol-USA adhesives are designed and developed to provide superior adhesion after sterilization and aging, resist humidity and moisture, maintain lot-to-lot consistency, and fully crosslink upon cure to assure biocompatibility to USP Class VI and ISO 10993 standards. |
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Thermally Conductive Adhesives
The ability of an electronic or electrical component to dissipate heat has a direct impact on its reliability and longevity. Heat dissipation can be improved in many component assembly applications by incorporating thermally conductive adhesives as bonding agents. Thermally conductive adhesives will channel heat from the bonded component to the attached substrate that functions as a heat sink or dissipater. Electrically conductive materials with metallic fillers are excellent at conducting heat due to their metal content. However, this also creates electrical conductivity, which may or may not be desirable. If only thermal conductivity is needed, non-metallic filled products should be utilized.
As their exclusive distributor for the Americas, Panacol-USA offers thermally conductive epoxies from Panacol-Elosol. Panacol-ElosolGmbH is a member of the Honle Group headquartered in Germany, and has been formulating and manufacturing adhesives for over 30 years.
View the thermally conductive products listed below for a possible candidate for your application. Please contact Panacol-USA to confirm your product selection and to secure additional application assistance, including samples and process recommendations.
Browse Panacol-USA Technical Documents for Product Details and Specifications